In: Proceedings of the 15th International Symposium on Applied Reconfigurable Computing (ARC). International Symposium on Applied Reconfigurable Computing (ARC-2019), April 9-11, Darmstadt, Germany, 2019.
Demóstenes Z. Rodríguez; Gabriel F. Pívaro; Renata L. Rosa; Gabriel Mittag; Sebastian Möller
In: Proceedings of 26th International Conference on Software, Telecommunications and Computer Networks (SoftCOM). International Conference on Software, Telecommunications and Computer Networks (SoftCom-2018), September 13-15, Split, Croatia, Pages 1-5, SoftCOM, ISBN 978-9-5329-0087-3, IEEE, 2018.
Demóstenes Z. Rodríguez; Gabriel F. Pívaro; Renata L. Rosa; Gabriel Mittag; Sebastian Möller
In: Proceedings of 26th International Conference on Software, Telecommunications and Computer Networks (SoftCOM). International Conference on Software, Telecommunications and Computer Networks (SoftCom-2018), September 13-15, Split, Croatia, Pages 1-5, SoftCOM, ISBN 978-9-5329-0087-3, IEEE, 2018.
In: Proceedings of Interspeech 2018. Conference in the Annual Series of Interspeech Events (INTERSPEECH), September 2-6, Hyderabad, India, Pages 1883-1887, Interspeech, ISCA, 2018.
Sebastian Möller; Tobias Hübschen; Gabriel Mittag; Gerhard Schmidt
In: Proceedings of 6th IEEE Global Conference on Signal and Information Processing. IEEE Global Conference on Signal and Information Processing (GlobalSIP-2018), November 26-28, Anaheim, CA, USA, Pages 1-5, GlobalSIP, IEEE, 2018.
In: 2018 IEEE International Symposium on Multimedia (ISM). IEEE International Symposium on Multimedia (ISM-2018), December 10-12, Taichung, Taiwan, Province of China, Pages 175-179, ISM, ISBN 978-1-5386-6857-3, IEEE, 2018.
In: IEEE International Conference on Pervasive Computing and Communications. IEEE International Conference on Pervasive Computing and Communications (PerCom-2019), March 11-15, Kyoto, Japan, IEEE, 2019.
In: IEEE International Conference on Pervasive Computing and Communications. IEEE International Conference on Pervasive Computing and Communications (PerCom-2019), 17th, March 11-15, Kyoto, Japan, Pages 136-145, ISBN 978-1-5386-9148-9, IEEE, 4/2019.