Skip to main content Skip to main navigation

Publications

Displaying results 321 to 330 of 511.
  1. Contextual Classification Using Self-Supervised Auxiliary Models for Deep Neural Networks

    In: 2020 25th International Conference on Pattern Recognition (ICPR). International Conference on Pattern Recognition (ICPR-2020), Online, Pages 8937-8944, Vol. 1, No. 1, IEEE, 5/2021.

  2. Marja Fleitmann; Hristina Uzunova; Andreas Martin Stroth; Jan Gerlach; Alexander Fürschke; Jörg Barkhausen; Arpad Bischof; Heinz Handels

    Deep-Learning-Based Feature Encoding of Clinical Parameters for Patient Specific CTA Dose Optimization

    In: Juan Ye; Michael J. O'Grady; Gabriele Civitarese; Kristina Yordanova (Hrsg.). Proceedings of the 10th EAI International Conference on Wireless Mobile Communication and Healthcare. International Conference on Wireless Mobile Communication and Healthcare (MobiHealth-2021), November 13-14, Chongqing/Virtual, China, Pages 315-322, ISBN 978-3-030-70569-5, Springer International Publishing, 2021.

  3. Hristina Uzunova; Jesse Kruse; Paul Kaftan; Matthias Wilms; Nils D Forkert; Heinz Handels; Jan Ehrhardt

    Analysis of Generative Shape Modeling Approaches: Latent Space Properties and Interpretability

    In: Bildverarbeitung für die Medizin 2021: Proceedings, German Workshop on Medical Image Computing, Regensburg, March 7-9, 2021. Workshop Bildverarbeitung für die Medizin (BVM-2021), March 7-9, Regensburg, Germany, Pages 344-349, Springer, 2021.

  4. Hristina Uzunova; Paul Kaftan; Matthias Wilms; Nils D. Forkert; Heinz Handels; Jan Ehrhardt

    Quantitative Comparison of Generative Shape Models for Medical Images

    In: Thomas Tolxdorff; Thomas M. Deserno; Heinz Handels; Andreas Maier; Klaus H. Maier-Hein; Christoph Palm (Hrsg.). Bildverarbeitung für die Medizin 2020. Workshop Bildverarbeitung für die Medizin (BVM-2020), March 15-17, Berlin, Germany, Pages 201-207, ISBN 978-3-658-29267-6, Springer Fachmedien Wiesbaden, 2020.

  5. Hardik Arora; Christoph Langenhan; Frank Petzold; Viktor Eisenstadt; Klaus-Dieter Althoff

    METIS-GAN: An approach to generate spatial configurations using deep learning and semantic building models

    In: Proceedings of the European Conference on Product and Process Modeling 2020-2021. European Conference on Product and Process Modeling (ECPPM-2021), May 5-7, Moscow, Russian Federation, European Association of Product and Process Modelling, 2021.

  6. Predictive Relay Selection: A Cooperative Diversity Scheme Using Deep Learning

    In: IEEE Wireless Communications and Networking Conference. IEEE Wireless Communications and Networking Conference (WCNC-2021), March 29 - April 1, Nanjing, China, IEEE, 2021.

  7. Kareem Amin; Stelios Kapetanakis; Klaus-Dieter Althoff; Andreas Dengel; Miltos Petridis

    Cases without borders: Automating Knowledge Acquisition Approach using Deep Autoencoders and Siamese Networks in Case-based Reasoning

    In: 2019 IEEE 31st International Conference on Tools with Artificial Intelligence. International Conference on Tools with Artificial Intelligence (AAAI SSS-2019), November 4-6, Portland, OR, USA, Pages 133-140, ISBN 978-1-7281-3798-8, IEEE Digital Library, 11/2019.

  8. A Deep Temporal Fusion Framework for Scene Flow Using a Learnable Motion Model and Occlusions

    In: Winter Conference on Applications of Computer Vision. IEEE Winter Conference on Applications of Computer Vision (WACV-2021), January 5-9, Waikoloa, HI, USA, IEEE, 2021.

  9. Sara Khan; Boris Brandherm; Anilkumar Swamy

    Electric Vehicle User Behavior Prediction Using Learning-Based Approaches

    In: 2020 IEEE Electric Power and Energy Conference (EPEC). IEEE Electric Power and Energy Conference (EPEC-2020), November 9-10, Edmonton, AB, Canada, ISBN 978-1-7281-6490-8, IEEE, 2020.

  10. Ghost Target Detection in 3D Radar Data using Point Cloud based Deep Neural Network

    In: International Conference on Pattern Recognition. International Conference on Pattern Recognition (ICPR-2020), 25th International Conference on Pattern Recognition, January 12-15, Milan, Italy, ISBN 978-1-7281-8808-9, IEEE, 5/2021.